Speaker: Aviv Ronen from Rafael ltd
Date: Wednesday, December 2, 2026
Time: 16:00 – 17:30 Israel Time
Language: English
Location: Zoom Session
Abstract:
For decades, chip design followed a linear workflow: electrical engineers designed the silicon, and only when tape-out approached was the IC handed over for packaging. Today, with the rise of high-power density, high-speed signals, and 2.5D/3D integration, treating packaging as an afterthought is a recipe for project failure.
This lecture highlights the critical need for early-stage integration between chip designers and packaging/microelectronic assembly engineers. Aimed at electrical engineers, this session will demonstrate how physical, thermal, and mechanical packaging constraints directly govern electrical performance—from power integrity and parasitics to thermomechanical stress and yield. Whether you are designing – digital ICs, RF components, or power management circuits – understanding why packaging engineers belong at the architecture table from Day One will change how you approach system-level design.
Bio:
Aviv serves as the Chief Technology Officer at Beckermus Technologies, where he bridges deep technical authority with commercial and strategic leadership. He holds a degree in Mechanical Engineering from the Technion – Israel Institute of Technology and brings over 23 years of specialized experience from his tenure in the Micro-Systems Department at Rafael.
As the technical voice of Beckermus, Aviv drives innovation in microelectronics, high-density semiconductor packaging, electro-optics, and materials science. Utilizing extensive expertise in precision CAD, thermal management, and advanced assembly workflows, he guides complex electro-optical concepts from early-stage architecture through to high-reliability, scalable manufacturing.
In addition to directing technology development and client acquisition, Aviv plays a prominent role in the broader engineering community. He currently serves as the Chairman of the IEEE EPS Israel Chapter and Chairman of the Electronic & Microelectronic Packaging Branch at the Association of Engineers, Architects and Academics in Technological Sciences in Israel (AEAI). Combining decades of defense-grade engineering experience with industry leadership, Aviv drives cutting-edge packaging solutions across demanding high-tech markets.
The webinar is free but registration is required!