Abstract:
Design of a stable, high-quality on-chip power distribution network is complicated and expensive. In this course, you will be introduced to the basic components of common power delivery systems. The problems of electromigration and IR drop, and the effect of on-chip decoupling capacitance will be discussed. We will explore the complexity and challenges in designing and modeling the on-chip power delivery grid, and will present common methods used in the industry today. Finally, future challenges and maturing technologies will be presented.
List of Topics:
Presenting the power distribution problem: IR drop and electromigration, Power delivery system, Package, Power Distribution Network, Importance, problems and challenges, On-chip decoupling capacitance, Power Network Modeling and Simulations: Resistance checks, Static analysis, Dynamic analysis, Signal Electromigration, Typical Problems and their Solutions, Future Challenges and Technologies: Growth in power consumption, 3D integration, Backside power delivery
Course Schedule:
Introduction to On-chip Power Distribution Networks – 9:30-10:45
Coffee Break – 10:45 – 11:15
On-chip Power Network Modeling and Simulations – 11:15-12:30
Lunch Break – 12:30 – 13:30
Typical Problems and their Solutions – 13:30 – 14:45
Coffee break – 14:45-15:15
Future Challenges and Technologies – 15:15-16:30
Date: September 15, 2024
Time: 9:30 – 16:30
Location: Auditorium 1003 Mayer Building, Technion, Haifa
Registration:
Note: Registration closes on Wednesday, 11th September 2024.