Supervisor: Prof Yitzhak Birk
Place: room 861 Electrical Eng. Building
You are invited to attend a lecture by
President and CEO of MonolithingIC 3d
Monolithic 3D – The effective alternative to Dimensional Scaling
The accelerating complexity and cost of dimensional scaling has given birth to “More than Moore”, of which 3D IC is
one of the leading drivers. Recent breakthroughs have added the option of practical monolithic 3D with a 10,000x
higher vertical connectivity. Multiple researchers have reported the potential of 3D IC with rich vertical connectivity to
provide significant average wire length reduction. In fact, some forecast that each device folding could be equivalent to
one process node of dimensional scaling.
We will present several 3D IC flows with their pros and cons, and the future implications.
We will also present how the technology could be apply to related application including:
Memories, Image sensor, Micro-Display and Wafer-Scale-Integration
The lecture will take place on Monday, 21/11/2011
at 10:30-11:30 in room 861
Electrical Eng. Building