Power Supply Issues in VLSI Systems

Supervisor: Prof. Avinoam Kolodny

Place: Technion, EE building, Auditorium 1003 (10th floor)

Date: 18.7.10


ACRC Workshop on Challenges and Recent Research in On-Chip Power Delivery

July 18, 2010
Technion, EE building, Auditorium 1003 (10th floor)

Goals: The core issues in on-chip power delivery will be discussed, and related research problems outlined. Some examples of specific research results in the area of on-chip DC-DC conversion and algorithms for efficient IR drop analysis will also be described.
Participants: Engineers from ACRC companies, graduate students and researchers engaged in various aspects of power supply subsystems (e.g. voltage conversion, regulation, on-chip power delivery, power management).

09:30 – 10:00   Registration and refreshments
10:00 – 10:45   Prof. Eby Friedman (Technion)
Introduction/Tutorial: Challenges of Power Delivery
in VLSI Systems
10:45 – 11:15   Dr. Michael Zelikson (Intel)
System-on-Chip Power Delivery Management – Goals,
Trends and Issues.
The main principles of a modern power delivery
system, possible development directions, anticipated
challenges and interes/files/2018/06/Challenges-of-Integrated-Systems-Power-Delivery-Management_-back.pdfting research directions.
Integrated Circuit Power Management Platforms incorporate
logic and analog blocks together with high voltage and
current power drivers on the same chip. This combination
allows serving a host of applications ranging from power
management in portable devices, power delivery in computer
motherboards through dc dc motor drives and to LED drivers
in street lighting and TV screens.
12:00 – 12:30   Eitan Rosen (Marvell)
Local and Global Investigation of On-chip Power
Simulations of Local and Global Power issues enable understanding
of issues and Power grid and de-coupling capacitors methodology

12:30 – 13:00  Nimrod Ben Ari (Zoran)
 Zoran On-chip Distributed Power Switch

Zoran Power Switch methodology and implementation, including
supporting peripheral circuits, And silicon results.

13:00 – 13: 30   Lunch Break

13:30 – 14:00   Gregory Sizikov (Intel)
Efficiency Considerations for On-chip DC-DC Buck Converters
An analytic method to evaluate frequency dependent losses in on-chip
DC-DC buck converters will be described. The analytical model will
be used for optimizing switching frequency and for minimizing losses
at light and heavy loads.

14:00 – 14:30   Dr. Aharon Unikovsky (Tower)
 A bandgap reference circuit for wide voltage range applications

A bandgap circuit that works in a voltage range of 4V up to 42V
with a very low current consumption and high PSRR.

14:30 – 14:45   Coffee Break

15:00 – 16:00
   Panel/Brainstorming session: Open research problems and development directions in VLSI power supply management

16:00 – 16:15   Conclusion

You are invited to a guest lecture after the seminar:
16:30-17:30 Dr.Ingmar Kallfass
The use and benefit of modern active millimeter-wave monolithic integrated circuit (MMIC) technology in high resolution sensing, imaging and high data rate wireless communication applications will be discussed. State-of-the-art in millimeter-wave low-noise and solid-state power amplification is briefly covered. Examples of MMICs based on state-of-the-art metamorphic high electron mobility transistor (mHEMT) technology with gate lengths down to 35 nm and cutoff frequencies fT of over 500 GHz and fmax of more than 700 GHz will be presented. A focus is on the multifunctional integration of analog frontend receivers and transmitters as well as frequency multipliers covering the entire millimeter-wave range up to and beyond 300 GHz. Furthermore, an ongoing Technion – Fraunhofer cooperation in the field of high-speed analog-to-digital converters based on InP hetero-bipolar transistor technology is introduced.